Semiconductor Manufacturing Handbook 2E (PB)

Semiconductor Manufacturing Handbook 2E (PB)

by Hwaiyu Geng
Semiconductor Manufacturing Handbook 2E (PB)

Semiconductor Manufacturing Handbook 2E (PB)

by Hwaiyu Geng

eBook

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Overview

Thoroughly Revised, State-of-the-Art Semiconductor Design, Manufacturing, and Operations Information

Written by 70 international experts and reviewed by a seasoned technical advisory board, this fully updated resource clearly explains the cutting-edge processes used in the design and fabrication of IC chips, MEMS, sensors, and other electronic devices. Semiconductor Manufacturing Handbook, Second Edition, covers the emerging technologies that enable the Internet of Things, the Industrial Internet of Things, data analytics, artificial intelligence, augmented reality, and and smart manufacturing. You will get complete details on semiconductor fundamentals, front- and back-end processes, nanotechnology, photovoltaics, gases and chemicals, fab yield, and operations and facilities.

•Nanotechnology and microsystems manufacturing

•FinFET and nanoscale silicide formation

•Physical design for high-performance, low-power 3D circuits

•Epitaxi, anneals, RTP, and oxidation

•Microlithography, etching, and ion implantations

•Physical, chemical, electrochemical, and atomic layer vapor deposition

•Chemical mechanical planarization

•Atomic force metrology

•Packaging, bonding, and interconnects

•Flexible hybrid electronics

•Flat-panel,flexible display electronics, and photovoltaics

•Gas distribution systems

•Ultrapure water and filtration

•Process chemicals handling and abatement

•Chemical and slurry handling systems

•Yield management, CIM, and factory automation

•Manufacturing execution systems

•Advanced process control

•Airborne molecular contamination

•ESD controls in clean-room environments

•Vacuum systems and RF plasma systems

•IC manufacturing parts cleaning technology

•Vibration and noise design

•And much more


Product Details

ISBN-13: 9781259583124
Publisher: McGraw Hill LLC
Publication date: 10/06/2017
Sold by: Barnes & Noble
Format: eBook
Pages: 704
Sales rank: 549,613
File size: 65 MB
Note: This product may take a few minutes to download.

About the Author

Hwaiyu Geng, CMfgE, P.E., is a principal at Amica Research (Palo Alto, California), promoting green engineering and manufacturing programs. He has had over 40 years of diversified engineering and management experience, working with Applied Materials, Hewlett-Packard, and Intel on international high-tech projects. He has written and presented numerous technical papers at international conferences. Mr. Geng is also the author of McGraw-Hill's Manufacturing Engineering Handbook. He is a patent holder.

Table of Contents

PART 1: Semiconductor Fundamentals and Basic Materials
BOARD OF REVIEWERS
CONTRIBUTORS
PREFACE
ACKNOWLEDGMENTS

Chapter 1: How Semiconductor Chips Are Made - Hwaiyu Geng, Lin Zhou

Chapter 2: IC Design - Ilsun Park

Chapter 3: Silicon Substrates for Semiconductor Manufacturing - K.V. Ravi

Chapter 4: Copper, Low-k Dielectrics, and Their Reliability - Hazara S. Rathore, Kaushik Chanda

Chapter 5: Fundamentals-Silicide Formation on Si - L.P. Ren, King N. Tu

Chapter 6: Plasma Process Control - David J. Coumou

Chapter 7: Vacuum Technology - Peter Biltoft

Chapter 8: Photomask - Charles Howard
PART 2: Wafer Processing

Chapter 9: Microlithography - Chris A. Mack

Chapter 10: Ion Implantation and Rapid Thermal Processing - Michael Graf

Chapter 11: Wet Etching - Peng Zhang

Chapter 12: Plasma Etching - Shouliang Lai

Chapter 13: Physical Vapor Deposition - Florian Solzbacher

Chapter 14: Chemical Vapor Deposition - Edward J. McInerney

Chapter 15: Epitaxy - Jamal Ramdani, Giovanni Vaccari

Chapter 16: ECD Fundamentals - Tom Ritzdorf, John Klocks

Chapter 17: Chemical Mechanical Planarization - Timothy S. Dyer

Chapter 18: Wet Cleaning - Andrew Machamer
Part 3: Final Manufacturing

Chapter 19: Inspection, Measurement, and Test - Donald W. Blair

Chapter 20: Grinding, Stress Relief, and Dicing - Kazuhisa Arai, Yoshikazu Kobayashi, Hideaki Otani

Chapter 21: Packaging - Dietrich Tonnies, Michael Topper
Part 4: Nanotechnology, MEMS, and FPD

Chapter 22: Nanotechnology and Nanomanufacturing - Zhong L. Wang

Chapter 23: Fundamentals of Microelectromechanical Systems - Michael A. Huff

Chapter 24: Flat-Panel Display Technology and Manufacturing - David N. Liu
Part 5: Gases and Chemicals

Chapter 25: Specialty Gas and CDA Systems - Wayne D. Curcie

Chapter 26: Waste Gas Abatement Systems - Joseph D. Sweeney

Chapter 27: PFC Abatement - James C. Cox

Chapter 28: Chemical and Slurry Handling Systems - Kristin Cavicchi, Dan Barsness

Chapter 29: Fluid Handling Components for High Purity Liquid Chemicals and Slurries - Charles K. Gould

Chapter 30: Fundamentals of Ultrapure Water - David J. Albrecht
Part 6: Fab Yield, Operations, and Facilities

Chapter 31: Yield Management - Bo Li, Wayne Carriker

Chapter 32: Automated Material Handling System - Clint Harris

Chapter 33: CD Metrology and CD-SEM - Ram Peltinov, Mina Menaker

Chapter 34: Six Sigma - Bruno Scibilia, Yoan Dupret

Chapter 35: Advanced Process Control - Robert H. McCafferty

Chapter 36: Environmental, Health, and Safety (EHS) Considerations in Semiconductor Fabrication Facilities - Brett J. Davis, Steven R. Trammell

Chapter 37: Plan, Design, and Construction of a FAB - Industrial Design and Construction

Chapter 38: Cleanroom Design and Construction - Richard V. Pavlotsky, Stephen C. Beck

Chapter 39: Micro-Vibration and Noise Design - Michael Gandreau, Hal Amick

Chapter 40: ESD Controls in Cleanroom Environments - Larry Levit

Chapter 41: Airborne Molecular Contamination - Chris Muller

Chapter 42: Particle Monitoring in Semiconductor Manufacturing - Steven Kochevar, Jerry Gromala

Chapter 43: Wastewater Neutralization Systems - Richard E. Pinkowski
APPENDIX
INDEX
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